Zeng Weimin, Wu Chunsu, Wu Yinshun. Electroless Copper Plating[J]. Journal of nanchang hangkong university(Natural science edition), 1998, 12(1): 83-92.
Citation: Zeng Weimin, Wu Chunsu, Wu Yinshun. Electroless Copper Plating[J]. Journal of nanchang hangkong university(Natural science edition), 1998, 12(1): 83-92.
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Electroless Copper Plating

    Abstract
  • Electroless copper plating is anon-electrolytic method of deposition from solution.Using 77 references,electroless copper processes,solution controls,performance criteria,mechanisms and the engineering application are reviewed.The advantages and disadvantages of various processes,mechanisms of electroless copper plating are discussed.
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