A Study on the Technique of Electroless Cu Deposition on PCB With High Stability

The technique of electroless copper deposition on printed circuit boards (PCB)with high stability and moderate rate is obtained by orthogonal experimenting and stability of multicomplexing electroless copper deposition is studied by adding PdCl₂ in solution.The results show that decomposing time of solution can be much prolonged and the overall decomposing of solution is transformed into slow and partial decomposing on few grains when using multicomplexing.Stabilizer plays a role in restraining Cu⁺ and Cu⁰ from producing.