RAO You-hai, ZOU Ai-hua, LIU Yuan. Preparation of SiCp/Al Electronic Packaging Composite Preforms[J]. Journal of nanchang hangkong university(Natural science edition), 2010, 24(1): 30-34.
Citation: RAO You-hai, ZOU Ai-hua, LIU Yuan. Preparation of SiCp/Al Electronic Packaging Composite Preforms[J]. Journal of nanchang hangkong university(Natural science edition), 2010, 24(1): 30-34.

Preparation of SiCp/Al Electronic Packaging Composite Preforms

  • The effects of binder content,forming pressure and sintering processes on the particle volume fraction and strength of the preforms were investigated.The results show that the particle volume fraction of the preforms decreases while the strength of preforms increases with the increase of binder content,and the compressive strength of preforms comes up to a maximum value when the content of binder is 30%,then decreases slowly.The particle volume fraction and the compressive strength of preforms increase with forming pressure increasing when it is between 10-25MPa.With sinter temperature increasing,the particle volume fraction of preforms decreases gradually below 800℃,but has not an obvious change at the temperature higher than 800℃.The compressive strength of preforms increases with sinter temperature increasing and reaches to the maximum at 1100℃.
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