YANG Bin, CHEN Mei-ying, YAO Jun-ping, ZHANG Ji-shan. Fundamental study of new Si-Al electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 1-4.
Citation:
YANG Bin, CHEN Mei-ying, YAO Jun-ping, ZHANG Ji-shan. Fundamental study of new Si-Al electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 1-4.
YANG Bin, CHEN Mei-ying, YAO Jun-ping, ZHANG Ji-shan. Fundamental study of new Si-Al electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 1-4.
Citation:
YANG Bin, CHEN Mei-ying, YAO Jun-ping, ZHANG Ji-shan. Fundamental study of new Si-Al electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 1-4.
Fundamental study of new Si-Al electronic packaging materials
A brief review of the research and development of the traditional packaging materials is given. In this study,Si-Al(50~70wt%Si)alloys were fabricated by spray forming. The spray-formed alloys with high Si contents show fine and homogeneous microstructures,and especially they have,at the same time,lower thermal expansion coefficients,high heat conductivity and lower density compared with the traditional packaging materials.
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