Zhou Xian-liang, Wu Jian-hui, Zhang Jian-yun, Hua Xiao-zhen, Zhou Yun-jun. A Review of Metal-Martix Composites for Electronic Packaging[J]. Journal of nanchang hangkong university(Natural science edition), 2001, 15(1): 11-15.
Citation: Zhou Xian-liang, Wu Jian-hui, Zhang Jian-yun, Hua Xiao-zhen, Zhou Yun-jun. A Review of Metal-Martix Composites for Electronic Packaging[J]. Journal of nanchang hangkong university(Natural science edition), 2001, 15(1): 11-15.
shu

A Review of Metal-Martix Composites for Electronic Packaging

    Abstract
  • In this paper,a review of Metal Matrix Composites(MMCs)for electronic packaging is presented,and various factors which influence the thermal properties of materials including matrix,reinforcement,processing method are discussed.Al-matrix composites with SiC particle reinforcements,which have good prospect of application,is emphatically introduced.Then,some problems that need further investigation are presented.
    • FullText(HTML)
  • loading
    • References (19)
    • Relative Articles
  • Supplements (0)

Catalog

    Turn off MathJax
    Article Contents

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return