曾为民, 吴纯素, 吴荫顺. 化学镀铜[J]. 南昌航空大学学报(自然科学版), 1998, 12(1): 83-92.
引用本文: 曾为民, 吴纯素, 吴荫顺. 化学镀铜[J]. 南昌航空大学学报(自然科学版), 1998, 12(1): 83-92.
shu
Zeng Weimin, Wu Chunsu, Wu Yinshun. Electroless Copper Plating[J]. Journal of nanchang hangkong university(Natural science edition), 1998, 12(1): 83-92.
Citation: Zeng Weimin, Wu Chunsu, Wu Yinshun. Electroless Copper Plating[J]. Journal of nanchang hangkong university(Natural science edition), 1998, 12(1): 83-92.
shu

化学镀铜

Electroless Copper Plating

    摘要
  • 摘要: 化学镀铜是指不使用电解方法而从槽液中沉积镀铜.本文参考了国内外70多篇文献,论述了化学镀铜的工艺、溶液控制、关键因素、机理的研究及其工程应用等.并对各工艺、机理的优劣进行了讨论.

     

    Abstract: Electroless copper plating is anon-electrolytic method of deposition from solution.Using 77 references,electroless copper processes,solution controls,performance criteria,mechanisms and the engineering application are reviewed.The advantages and disadvantages of various processes,mechanisms of electroless copper plating are discussed.

     

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