曾为民, 曹经倩, 吴纯素, 吴荫顺. PCB高稳定性化学镀铜工艺研究[J]. 南昌航空大学学报(自然科学版), 2001, 15(1): 46-48.
引用本文: 曾为民, 曹经倩, 吴纯素, 吴荫顺. PCB高稳定性化学镀铜工艺研究[J]. 南昌航空大学学报(自然科学版), 2001, 15(1): 46-48.
Zeng Wei-min, Cao Jing-qian, Wu Chun-su, Wu Yin-shun. A Study on the Technique of Electroless Cu Deposition on PCB With High Stability[J]. Journal of nanchang hangkong university(Natural science edition), 2001, 15(1): 46-48.
Citation: Zeng Wei-min, Cao Jing-qian, Wu Chun-su, Wu Yin-shun. A Study on the Technique of Electroless Cu Deposition on PCB With High Stability[J]. Journal of nanchang hangkong university(Natural science edition), 2001, 15(1): 46-48.

PCB高稳定性化学镀铜工艺研究

A Study on the Technique of Electroless Cu Deposition on PCB With High Stability

  • 摘要: 通过正交试验得到了化学镀铜速率适中而稳定性极高的化学镀铜工艺;采用PdCl2加速分解实验研究了多元络合剂化学镀铜液的稳定性.结果表明:使用多元络合剂时存在交互作用可大大延长镀液的分解时间,同时使镀液的全面分解转变为少量颗粒上的缓慢分解.稳定剂的加入主要是抑制Cu+的生长,同时也降低了金属铜的生成速率.

     

    Abstract: The technique of electroless copper deposition on printed circuit boards (PCB)with high stability and moderate rate is obtained by orthogonal experimenting and stability of multicomplexing electroless copper deposition is studied by adding PdCl2 in solution.The results show that decomposing time of solution can be much prolonged and the overall decomposing of solution is transformed into slow and partial decomposing on few grains when using multicomplexing.Stabilizer plays a role in restraining Cu+ and Cu0 from producing.

     

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