Abstract:
Nano-SiO
2/epoxy resins/Organosilicon was prepared by modification epoxy resins/Organosilicon with nano-SiO
2 treated by coupling agent.Composites of nano-SiO
2/epoxy resins/Organosilicon were indicated by IR analysis.It was shown by TGA and volume resistances analyses that epoxy resins were modified obviously by nano-SiO
2.A model for heat compounded temperature and volume resistivity of Nano-SiO
2/epoxy resins/Organosilicon composite in the preparation process was developed by uniform design.Analysis of variance revealed that the models developed were adequate.The heat compound temperature can be increased with the increase of Nano-SiO
2 but the volume resistances can be decrease as the increased of Nano-SiO
2.