杨滨, 陈美英, 尧军平, 张济山. 新型电子封装Si-Al合金的基础研究[J]. 南昌航空大学学报(自然科学版), 2004, 18(1): 1-4.
引用本文: 杨滨, 陈美英, 尧军平, 张济山. 新型电子封装Si-Al合金的基础研究[J]. 南昌航空大学学报(自然科学版), 2004, 18(1): 1-4.
YANG Bin, CHEN Mei-ying, YAO Jun-ping, ZHANG Ji-shan . Fundamental study of new Si-Al electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 1-4.
Citation: YANG Bin, CHEN Mei-ying, YAO Jun-ping, ZHANG Ji-shan . Fundamental study of new Si-Al electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 1-4.

新型电子封装Si-Al合金的基础研究

Fundamental study of new Si-Al electronic packaging materials

  • 摘要: 对传统金属电子封装材料的研究开发现状进行了简单评述.利用喷射沉积成形技术制备了Si-Al(含硅量50~70wt%)合金.这种合金具有细小均匀的显微组织,同时具有低热膨胀系数、高热传导率和低密度等特点.

     

    Abstract: A brief review of the research and development of the traditional packaging materials is given. In this study,Si-Al(50~70wt%Si)alloys were fabricated by spray forming. The spray-formed alloys with high Si contents show fine and homogeneous microstructures,and especially they have,at the same time,lower thermal expansion coefficients,high heat conductivity and lower density compared with the traditional packaging materials.

     

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