尧军平, 杨滨, 张磊, 陈美英, 张济山. 喷射成形电子封装Si-Al合金凝固过程模拟研究[J]. 南昌航空大学学报(自然科学版), 2004, 18(1): 5-9.
引用本文: 尧军平, 杨滨, 张磊, 陈美英, 张济山. 喷射成形电子封装Si-Al合金凝固过程模拟研究[J]. 南昌航空大学学报(自然科学版), 2004, 18(1): 5-9.
YAO Jun-ping, YANG Bin, ZHANG Lei, CHEN Mei-ying, ZHANG Ji-shan. Simulation of solidification behavior in spray-deposited Si-Al preforms used for electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 5-9.
Citation: YAO Jun-ping, YANG Bin, ZHANG Lei, CHEN Mei-ying, ZHANG Ji-shan. Simulation of solidification behavior in spray-deposited Si-Al preforms used for electronic packaging materials[J]. Journal of nanchang hangkong university(Natural science edition), 2004, 18(1): 5-9.

喷射成形电子封装Si-Al合金凝固过程模拟研究

Simulation of solidification behavior in spray-deposited Si-Al preforms used for electronic packaging materials

  • 摘要: 为了优化喷射成形Si-Al合金成形工艺,获得优良的显微组织,本文模拟了喷射成形Si-30wt%Al合金的凝固过程.研究了雾化压力和沉积距离对熔滴冷却过程中的温度和固相分数的影响.模拟计算结果得到实验验证.

     

    Abstract: To optimize the spray forming process and obtain desired Si-Al preform microstructures,it is essential to make a full understanding of the solidification process of the alloys. In this study,a numerical simulation of solidification behavior for spray-deposited Si-30wt%Al preforms has been calculated and discussed. The influence of atomization pressure and axial distance on the Si-30wt%Al droplet temperature and solid fraction was discussed. The calculated results of numerical simulation for the alloy have been verified to be accurate.

     

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