周贤良, 吴江晖, 张建云, 华小珍, 周云军. 电子封装用金属基复合材料的研究现状[J]. 南昌航空大学学报(自然科学版), 2001, 15(1): 11-15.
引用本文: 周贤良, 吴江晖, 张建云, 华小珍, 周云军. 电子封装用金属基复合材料的研究现状[J]. 南昌航空大学学报(自然科学版), 2001, 15(1): 11-15.
shu
Zhou Xian-liang, Wu Jian-hui, Zhang Jian-yun, Hua Xiao-zhen, Zhou Yun-jun. A Review of Metal-Martix Composites for Electronic Packaging[J]. Journal of nanchang hangkong university(Natural science edition), 2001, 15(1): 11-15.
Citation: Zhou Xian-liang, Wu Jian-hui, Zhang Jian-yun, Hua Xiao-zhen, Zhou Yun-jun. A Review of Metal-Martix Composites for Electronic Packaging[J]. Journal of nanchang hangkong university(Natural science edition), 2001, 15(1): 11-15.
shu

电子封装用金属基复合材料的研究现状

A Review of Metal-Martix Composites for Electronic Packaging

    摘要
  • 摘要: 本文介绍了电子封装用金属基复合材料的研究现状,分别从基体、增强体、制备工艺几方面讨论了其对复合材料性能的影响,着重介绍了作为电子封装材料应用前景较好的高比例SiC颗粒增强铝基复合材料及其已部分实现规模工业化生产的铸造法.并进一步提出了尚待解决的问题.

     

    Abstract: In this paper,a review of Metal Matrix Composites(MMCs)for electronic packaging is presented,and various factors which influence the thermal properties of materials including matrix,reinforcement,processing method are discussed.Al-matrix composites with SiC particle reinforcements,which have good prospect of application,is emphatically introduced.Then,some problems that need further investigation are presented.

     

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