Abstract: A new type of corrosion inhibitor A was added to the traditional electroless gold plating solution, and its effect on the corrosion inhibition of the nickel layer, the plating speed, the corrosion resistance of the gold plating and the adhesion of the gold plating were studied. The results show that after adding the corrosion inhibitor, the plating speed is hardly affected. The corrosion thickness of the nickel layer of the obtained plating parts is greatly reduced from 1.85 μm, and the corrosion inhibition rate is close to 100%. And with the addition of corrosion inhibitor A, the adhesion of the coating is greatly improved, and the pull-off strength can be increased by 73.37% at the maximum. In addition, the corrosion resistance of the gold plating layer obtained after the corrosion inhibitor is added is also significantly improved, and the surface of the gold plating layer obtained is dense and smooth, without obvious holes or cracks.