Abstract: In the present work, copper plating with porous structure was obtained on the surface of the 304 stainless steel via electrode position process. The impact of current density on the micro-morphology, thickness and the specific surface area of the porous Cu plating was investigated. The results show that different coatings with granular, dendritic and needle-like shapes can be obtained on the surface of 304 stainless steel by controlling the deposition current density. The coating thickness increases with the increase of the current density, but they are not linearly related to each other, as the current increases, the growth rate of the coating thickness becomes slower. The porosity of the coating increases with the increase of current density, after the current density reaches 6 A/dm², the porosity of the coating is maintained between 93%~96%. The specific surface area of the coating increases rapidly with the increase of the current density, and then increases slowly. The specific surface area of the coating under condition 10 A/dm² is 10 times that under condition 4 A/dm².