Review on Ultrasonic Testing Technology and Processing Method for Bonding Structure Quality

The requirement of nondestructive detection for the quality of the bonding structure is higher and higher, and ultrasonic testing method has many outstanding advantages and is widely used for the detection of bonding structure. According to the existing research status, several ultrasonic testing techniques which have currently used in bonding structure detection are introduced here and the application characteristics of these methods are analyzed, and the ultrasonic guided wave detection method has promising application in those methods. It is expected that the ultrasonic guided wave detection method for detecting the bonding quality is one of the hot research for a period of time in future. And finally, three time-frequency processing methods for ultrasonic testing signal are analyzed, and these methods have different emphasis point, and it can be selected the corresponding processing method according to the different requirement.