龚欣,李超,王朝华,等. 合闸电阻片裂纹的超声水浸扫描检测工艺参数综合评价[J]. 失效分析与预防,2025,20(5):355-363. doi: 10.3969/j.issn.1673-6214.2025.05.003
    引用本文: 龚欣,李超,王朝华,等. 合闸电阻片裂纹的超声水浸扫描检测工艺参数综合评价[J]. 失效分析与预防,2025,20(5):355-363. doi: 10.3969/j.issn.1673-6214.2025.05.003
    GONG Xin,LI Chao,WANG Chaohua,et al. Evaluation and optimization on testing parameters of ultrasonic hydro immersion scanning for closing resistor plates[J]. Failure analysis and prevention,2025,20(5):355-363. doi: 10.3969/j.issn.1673-6214.2025.05.003
    Citation: GONG Xin,LI Chao,WANG Chaohua,et al. Evaluation and optimization on testing parameters of ultrasonic hydro immersion scanning for closing resistor plates[J]. Failure analysis and prevention,2025,20(5):355-363. doi: 10.3969/j.issn.1673-6214.2025.05.003

    合闸电阻片裂纹的超声水浸扫描检测工艺参数综合评价

    Evaluation and Optimization on Testing Parameters of Ultrasonic Hydro Immersion Scanning for Closing Resistor Plates

    • 摘要: 为实现特高压设备中合闸电阻片安装前的质量均匀性无损评价,本文基于超声水浸扫描技术,对合闸电阻片裂纹缺陷的检测工艺进行了优化,并研究了关键参数的影响。文中提出了一种综合考虑检出概率、噪声水平、改进信噪比及扫描时间的积分制综合评价方法,系统分析了检测频率、扫描步进间隔、聚焦位置及成像方式对检测结果的影响,优化了检测工艺并验证其有效性。结果表明:“5P6F25-0.62 mm-中上聚焦−底波成像”与“2.25P6F10-0.62 mm-中上聚焦−底波成像”工艺组合的检测效果最优。检测频率低于5 MHz的超声波穿透力强,结合底波成像检测效果最优,缺陷检出率达100%,其改进信噪比的绝对值显著优于高频探头;检测频率高于7.5 MHz时,超声波衰减严重导致底波丢失,检出概率为0;扫描步进间隔0.62 mm时,在保证检出概率的前提下,扫描时间较0.31 mm间隔缩短40%。三维C-Scan成像结果进一步验证了优化工艺对电阻片表面及深层裂纹检测的可靠性。

       

      Abstract: To enable the non-destructive evaluation of quality uniformity in closing resistor plates prior to their installation in UHV equipment, this study optimized the detection process for crack defects using ultrasonic hydro immersion scanning technology. The influence of key detection parameters was systematically investigated. An integrated system evaluation method is proposed, which incorporates detection probability, noise level, a refined signal-to-noise ratio metric, and scanning time. This method was used to analyze the effects of detection frequency, scanning step interval, focal position, and imaging method on the inspection results. The detection process was optimized and its effectiveness was validated. The results indicate that the optimal detection performance was achieved with the parameter combinations: “5P6F25-0.62 mm-upper focus-bottom wave imaging” and “2.25P6F10-0.62 mm-middle upper focus-bottom wave imaging.” The ultrasonic waves with a detection frequency lower than 5 MHz have strong penetration. When combined with bottom-wave imaging, the detection effect is the best, with a defect detection rate of 100%. The refined signal-to-noise ratio (SNR) metric was significantly better than that obtained with high-frequency probes. At frequencies exceeding 7.5 MHz, severe ultrasonic attenuation led to a complete loss of the bottom wave signal and a detection probability of 0. A scanning step interval of 0.62 mm reduced the total scanning time by 40% compared to 0.31 mm interval, while maintaining the same detection probability. 3D C-Scan imaging results confirmed the reliability of the optimized process for detecting both surface and sub-surface cracks in the resistor plates.

       

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