王大为, 郑真, 陈星. GH3030钎焊管接头裂纹分析[J]. 失效分析与预防, 2019, 14(3): 193-199. DOI: 10.3969/j.issn.1673-6214.2019.03.011
    引用本文: 王大为, 郑真, 陈星. GH3030钎焊管接头裂纹分析[J]. 失效分析与预防, 2019, 14(3): 193-199. DOI: 10.3969/j.issn.1673-6214.2019.03.011
    WANG Da-wei, ZHEN Zhen, CHEN Xing. Cracking Analysis of Joint of GH3030 Soldered Pipe[J]. Failure Analysis and Prevention, 2019, 14(3): 193-199. DOI: 10.3969/j.issn.1673-6214.2019.03.011
    Citation: WANG Da-wei, ZHEN Zhen, CHEN Xing. Cracking Analysis of Joint of GH3030 Soldered Pipe[J]. Failure Analysis and Prevention, 2019, 14(3): 193-199. DOI: 10.3969/j.issn.1673-6214.2019.03.011

    GH3030钎焊管接头裂纹分析

    Cracking Analysis of Joint of GH3030 Soldered Pipe

    • 摘要: 在试验过程中有2个构件钎焊管在焊接接头处发生泄漏,试验温度约400 ℃,钎焊管在正常工况下受交变应力。通过外观观察、裂纹宏微观观察、断口观察、能谱分析、金相检查、硬度检测等方法,对构件的失效原因进行综合分析。结果表明:构件钎焊管由于焊接过热导致沿晶裂纹的产生与2个焊接位置相距较近有关,焊接时存在互相影响,且存在焊接温度控制不当的情况。建议严格控制焊接过程,并对构件的焊接结构进行改进。

       

      Abstract: Leakage occurred to two soldered pipes at the position of soldered joint when test was carried out under alternating stress at about 400 ℃. In order to find out the failure cause, appearance observation, crack observation, fracture observation, EDS analysis, microstructure examination and microhardness testing were carried out. The results show that the occurrence of overheated intergranular cracks in soldered pipes is related to the small distance between the two soldered joints, mutual influence exists between them during soldering process, and the soldering temperature is improper. It is suggested to control the soldering process strictly and improve the soldered structure of the components.

       

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