张震, 曾亮, 张永华, 李秋锋, 习璐颖. 粘接结构质量超声检测和信号处理方法[J]. 失效分析与预防, 2014, 9(2): 126-130. DOI: 10.3969/j.issn.1673-6214.2014.02.014
    引用本文: 张震, 曾亮, 张永华, 李秋锋, 习璐颖. 粘接结构质量超声检测和信号处理方法[J]. 失效分析与预防, 2014, 9(2): 126-130. DOI: 10.3969/j.issn.1673-6214.2014.02.014
    ZHANG Zhen, ZENG Liang, ZHANG Yong-hua, LI Qiu-feng, XI Lu-ying. Review on Ultrasonic Testing Technology and Processing Method for Bonding Structure Quality[J]. Failure Analysis and Prevention, 2014, 9(2): 126-130. DOI: 10.3969/j.issn.1673-6214.2014.02.014
    Citation: ZHANG Zhen, ZENG Liang, ZHANG Yong-hua, LI Qiu-feng, XI Lu-ying. Review on Ultrasonic Testing Technology and Processing Method for Bonding Structure Quality[J]. Failure Analysis and Prevention, 2014, 9(2): 126-130. DOI: 10.3969/j.issn.1673-6214.2014.02.014

    粘接结构质量超声检测和信号处理方法

    Review on Ultrasonic Testing Technology and Processing Method for Bonding Structure Quality

    • 摘要: 粘接结构的粘接质量无损检测要求越来越高,而超声检测方法具有更突出的优点被广泛应用。结合现有的研究状况,介绍目前在粘接质量检测上使用的几种超声检测方法,全面分析了这些方法的应用特点,超声导波检测方法具有更广阔的应用前景,可以预期采用超声导波检测方法检测粘接结构质量将是未来一段时间研究的热点之一。最后对3种常用的超声检测信号时频处理方法进行了分析,这些方法具有不同侧重点,可根据不同需求采用相应处理方法。

       

      Abstract: The requirement of nondestructive detection for the quality of the bonding structure is higher and higher, and ultrasonic testing method has many outstanding advantages and is widely used for the detection of bonding structure. According to the existing research status, several ultrasonic testing techniques which have currently used in bonding structure detection are introduced here and the application characteristics of these methods are analyzed, and the ultrasonic guided wave detection method has promising application in those methods. It is expected that the ultrasonic guided wave detection method for detecting the bonding quality is one of the hot research for a period of time in future. And finally, three time-frequency processing methods for ultrasonic testing signal are analyzed, and these methods have different emphasis point, and it can be selected the corresponding processing method according to the different requirement.

       

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